3D Thermal Stress Models for Single Chip SiC Power Sub …
3D Thermal Stress Models for Single Chip SiC Power Sub-Modules Bang-Hung Tsao1, Jacob Lawson1, and James Scofield2 1University of Dayton Reserach Institute, 300 College Park, Dayton, OH, 45469-0074 2Air Force Reserach Labratory, WPAFB, OH, 45433